Package Roadmap Tool Intern – Package Innovation

Save

NXP Semiconductors · Kuala Lumpur, Malaysia

Moving for this job

Relocation plan for this job:

for EU citizens for citizens of other countries

Take-home pay, visa, documents and where to get them, step by step.

How much is left at the end of the month?

Job description

Published by NXP Semiconductors. The company's advert prevails.

Package Roadmap Tool Intern – Package Innovation

Role SummaryDevelop and enhance tools to enable structured definition, visualization, and management of package technology roadmaps across platforms.

Key Responsibilities
Design and implement a Package Roadmap Tool to track technology evolution, capabilities, and platform alignment
Participate and support Platform Manager lead to integrate inputs from business lines, competitive analysis, and supplier data into a centralized roadmap framework
Improve data structure, usability, and automation of roadmap tracking (e.g., dashboards, visualizations)
Participate and support Platform Manager lead for roadmap reviews and ensure alignment with PI strategy, cost targets, and technology readiness
Collaborate cross-functionally with platform, API, and manufacturing teams

Additional Exposure
Participate in ATKL manufacturing projects to build foundational knowledge of package assembly and process flows

Qualifications
Degree candidate in Computer Science (preferred), Engineering, or related field
Strong programming and data structuring skills (e.g., Python, data tools, automation frameworks)
Experience with Excel, Power BI, or similar tools for visualization and tool development
Ability to translate technical inputs into structured, scalable frameworks
Self-driven with strong collaboration and communication skills

More information about NXP in Malaysia...

#LI-633a

Apply on NXP Semiconductors's site