GoNextPackage Roadmap Tool Intern – Package Innovation
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Publicado por NXP Semiconductors. Prevalece o anúncio da empresa.
Package Roadmap Tool Intern – Package Innovation
Role SummaryDevelop and enhance tools to enable structured definition, visualization, and management of package technology roadmaps across platforms.
Key Responsibilities
Design and implement a Package Roadmap Tool to track technology evolution, capabilities, and platform alignment
Participate and support Platform Manager lead to integrate inputs from business lines, competitive analysis, and supplier data into a centralized roadmap framework
Improve data structure, usability, and automation of roadmap tracking (e.g., dashboards, visualizations)
Participate and support Platform Manager lead for roadmap reviews and ensure alignment with PI strategy, cost targets, and technology readiness
Collaborate cross-functionally with platform, API, and manufacturing teams
Additional Exposure
Participate in ATKL manufacturing projects to build foundational knowledge of package assembly and process flows
Qualifications
Degree candidate in Computer Science (preferred), Engineering, or related field
Strong programming and data structuring skills (e.g., Python, data tools, automation frameworks)
Experience with Excel, Power BI, or similar tools for visualization and tool development
Ability to translate technical inputs into structured, scalable frameworks
Self-driven with strong collaboration and communication skills
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