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Process and Equipment Tech

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NXP Semiconductors · Kuala Lumpur, Malaysia

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Job description

Published by NXP Semiconductors. The company's advert prevails.

Plating Process Technician
 
Carryout the following activities
 
Set up Plating Line as process  specification Setting up recipes based on product requirement Set up and maintenance of plating baths and miscellaneous related equipment related to electroplating Responsible for chemical addition based on lab analysis Chemical Filtration & Leaching activity Anode Top Up for respective plating lines
 
 
Requirement:
1)   Diploma in Engineering (Chemical, Mechanical) or related
2)   Previous experience in electroplating in semiconductor assembly
 
 
 
Plating Equipment Technician
 
Carryout the following activities
 
Set up Plating Line Loader and Unloader Change Over of Loader and Unloader Carryout periodical maintenance for plating machine Maintenance  of plating machine fittings Replacement of Plating Pumps and Rectifiers Serving Pumps and Blowers
 
 
Requirement:
1)   Diploma in Engineering (Electric/ Electronic, Mechanical) or related
2)   Previous experience in electroplating in semiconductor assembly

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Apply on NXP Semiconductors's site