Senior Principal Foundry Engineer - HV/BCD Process Integration

Operations 3rd Party Foundries :- Co-ordinate all Wafer Manufacturing related activities.- Ensure available capacity is in place to cover both STP and LTP volumes. Taking into account type split and capacity bottlenecks.- Drive BBSC for all 3rdParty Foundries for Delivery, through put time, Yield and Quality including follow up on improvement actions- Monitor, review and manage any process changes/improvements supporting requests both from 3rd Party Foundries to BL’s and from BL’s to 3rd Party Foundries.Co-ordinate and drive solutions to customer complaints hold lots and yield/processing excursions related to 3rdParty Foundry ensuring route cause is understood and corrective actions are in place. Program management 3rdParty Foundries:- Define time-line, resources, risk-mitigations (technical & non technical)activities to ensure timely and satisfactory completion of the project- Be responsible for monitoring and controlling the execution of the project as per agreed time-line- Drive all new product transfers activities in External Foundries with support of NXP project team (Innovation, mother fab, BL) and local project team of External Foundry- Actively coordinate process qualification, product introduction and qualification- Stimulate/oversee structural problems solving by use of statistical and quality tools- Chair and organize process gate meetings- Report to NXP stakeholders and External Foundries counterparts (PRB/Steering Committee)- Be the interface between NXP and External Foundries during project execution- Coordinate safe-launch and volume ramp-up implementation, monitor with support of the local technical team continuous yield & process improvement activities General areas of responsibility include:- Relation management and communication interface to all 3rdParty Foundries within their area.- Drive Quarterly review with 3rdParty Foundries including follow up on actions- Support Foundry Sourcing group in cost/price negotiations and discussions with both existing and new 3rd Party Foundries Job Requirement :Minimum Qualifications:- Bachelor/Master in Engineering/Material Science/Electronic- Minimum 7 years working experience preferably in semiconductor fab environment (Process Integration, Device/Yield engineer preferred)- Well verse in English and Chinese. This role involves regular interaction with Mandarin-speaking suppliers. Therefore, fluency in spoken Mandarin is required to facilitate effective communication and stakeholder engagement.- Able to work independently and also handle cross functional projects Preferred Qualifications:- Six sigma green belt and above, SPC knowledge, Semiconductor Devices and Process knowledge- Knows statistical tool KLA ACE XP, JMP, SPS etc
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