GoNextProcess Engineer
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Salário líquido, visto, documentos e onde os pedir, passo a passo.
Descrição da vaga
Publicado por NXP Semiconductors. Prevalece o anúncio da empresa.
Job Summary:
Seeking a Process Engineer with 3-5 years of semiconductor industry experience in Wafer Saw (Dicing), Blade Dicing, Backgrind, or DBG processes.
Job Responsibility
Define/optimize procedures to ensure smooth processing of production lots
Develop and maintain process documentation and SOPs including operator training
Lead root cause analysis for defects and yield losses
Provide disposition on lots with quality issues
Support new product introduction and process qualification
Analyze production data to identify process improvements
Collaborate with cross-functional teams on cost reduction and process improvement projects
Perform change management including new material qualification
Qualification
Bachelor's or master's degree in Engineering (Electronics, industrial, Chemical, Mechanical, or related field).
3–5 years of process engineering experience with standard backgrind and dicing before grinding (DBG) process.
Strong data analysis and problem-solving skills.
Experience with Statistical Process Control (SPC) and process validation (preferred).
With good command of English language.
Knowledge of Lean, Six Sigma, or continuous improvement tools (advantage).
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