Internship project for automotive RF substrates
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Descrição da vaga
Publicado por NXP Semiconductors. Prevalece o anúncio da empresa.
•Title:
•Electrical and material characterization of DS7409KNF new low loss core material for radar applications
•
•Goal:
•Link material RF properties measured in RF lab to substrates (RF) structures.
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•Scope:
•Work on DC electrical test vehicles setup development by Davey. Check substrate MFG for MSAP en tenting in 6L Doosan stack
•Work with Fabry Perot setup in RF lab to characterize Doosan and today MGC material
•Translate material RF characterization in RF lab to 6L substrate stack performance
•If time left, run reliability experiments using our 6L ETV structures. (content to align with Romuald)
More information about NXP in the Netherlands...
#LI-3623